JPH0252442U - - Google Patents
Info
- Publication number
- JPH0252442U JPH0252442U JP13292988U JP13292988U JPH0252442U JP H0252442 U JPH0252442 U JP H0252442U JP 13292988 U JP13292988 U JP 13292988U JP 13292988 U JP13292988 U JP 13292988U JP H0252442 U JPH0252442 U JP H0252442U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- integrated circuit
- circuit chip
- wiring layers
- fingers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13292988U JPH0252442U (en]) | 1988-10-11 | 1988-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13292988U JPH0252442U (en]) | 1988-10-11 | 1988-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252442U true JPH0252442U (en]) | 1990-04-16 |
Family
ID=31390341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13292988U Pending JPH0252442U (en]) | 1988-10-11 | 1988-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252442U (en]) |
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1988
- 1988-10-11 JP JP13292988U patent/JPH0252442U/ja active Pending